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Thermal Conductivity Measuring Instrument Product List and Ranking from 11 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

Thermal Conductivity Measuring Instrument Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. 横浜電子 Kanagawa//Industrial Electrical Equipment
  2. ＤＪＫ Kanagawa//Resin/Plastic
  3. グロッツ・ベッケルトジャパン 本社 Osaka//Trading company/Wholesale
  4. 4 ネッチ・ジャパン Kanagawa//Testing, Analysis and Measurement
  5. 5 ベテル 本社・工場、東京オフィス、ハドソン研究所、ベトナム工場 Ibaraki//Manufacturing and processing contract
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Thermal Conductivity Measuring Instrument Product ranking

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
This ranking is based on the number of page views on our site.

  1. Disc Heat Flow Meter Method (ASTM E1530) ＤＪＫ
  2. Thermal Conductivity Measurement Device Comprehensive Catalog 横浜電子
  3. C-THERM Contact Cooling Sensation and Thermal Conductivity Measurement Device グロッツ・ベッケルトジャパン 本社
  4. Measuring device for thermal conductivity measurement using the Guarded Hot Plate method (GHP method) 横浜電子
  5. 5 HFM 446 Lambda / Thermal Conductivity Measurement Device for Insulation Materials ネッチ・ジャパン

Thermal Conductivity Measuring Instrument Product List

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Thermal Conductivity Measurement Device Comprehensive Catalog

Thermal Conductivity Measurement Device Comprehensive Catalog

Assist in the development of new materials for thermal insulation and cooling! Achieve reduced measurement time and expanded measurement temperature range!

The thermal conductivity measurement device manufactured by Yokohama Electronics is a high-grade model that achieves a reduction in measurement time and an expansion of the measurement temperature range by providing two channels. We have completed a thermal conductivity measurement device that adopts the flat plate direct method, which is widely used as part of research and development and quality control in various industries. 【Featured Products】 ■ Thermal Conductivity Measurement Device 　□ Calibration Thermal Conductivity Measurement Device (Single Specimen / Two Specimens) 　□ Chamber for LN2 　□ Thermal Conductivity Control Panel ■ Standard Thermal Conductivity Measurement Device ■ Ultra-Low Temperature Thermal Conductivity Measurement Device ■ Control Panel for GHP For more details, please refer to the catalog or feel free to contact us.

  • Temperature and humidity measuring instruments
  • Other measurement, recording and measuring instruments

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Measuring device for thermal conductivity measurement (GUARD HOT PLATE)

Measuring device for thermal conductivity measurement (GUARD HOT PLATE)

This is a thermal conductivity measurement device that achieves a reduction in measurement time and an expansion of the measurement temperature range.

The thermal conductivity measurement device (GUARD HOT PLATE) has undergone extensive consideration and improvement over the years, focusing on absolute measurements in a steady state of heat transfer. Yokohama Electronics Co., Ltd. has completed a thermal conductivity measurement device that employs the flat plate direct method, leveraging years of rich experience and outstanding technology, and it is widely used as part of research and development and quality control in various industries. The thermal conductivity measurement device TYPE M361/3GHP JIS A 1412-11999 is a high-grade model that incorporates years of experience and modern technology, achieving a reduction in measurement time and an expansion of the measurement temperature range by providing two channels. 【Features】 - Reduction in measurement time - Expansion of measurement temperature range - High-grade model - -170 to 200℃ (with constant temperature layer for temperatures below 0℃) - 1K to 300K (with ultra-low temperature layer) For more details, please contact us or download the catalog.

  • Other measurement, recording and measuring instruments

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Measuring device for thermal conductivity measurement using the Guarded Hot Plate method (GHP method)

Measuring device for thermal conductivity measurement using the Guarded Hot Plate method (GHP method)

This is a thermal conductivity measurement device for the calibration of the Guarded Hot Plate Method (GHP method).

The thermal conductivity measurement device focuses on absolute measurements under steady-state conditions, and has undergone extensive consideration and improvement over the years. Yokohama Electronics Co., Ltd. has completed a thermal conductivity measurement device using the flat plate direct method, leveraging its rich experience and outstanding technology, which is widely used as part of research and development and quality control in various industries. The thermal conductivity measurement device using the Guarded Hot Plate method (GHP method) JIS A 1412-1-1999 employs both single specimen and double specimen methods, and utilizes a chamber for LN2. 【Features】 ○ Thermal conductivity measurement device using the Guarded Hot Plate method (GHP method) ○ JIS A 1412-1-1999 ○ Single specimen method ○ Double specimen method ○ Chamber for LN2 For more details, please contact us or download the catalog.

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Measuring device standard thermal conductivity measurement apparatus

Measuring device standard thermal conductivity measurement apparatus

Standard thermal conductivity measurement device set MODEL: TPλ/0211.

The thermal conductivity measurement device focuses on absolute measurements under steady-state conditions, and has undergone extensive consideration and improvements over the years. Yokohama Electronics Co., Ltd. has completed a thermal conductivity measurement device using the plate direct method, leveraging many years of rich experience and outstanding technology, which is widely used as part of research and development and quality control in various industries. We introduce the standard thermal conductivity measurement device set MODEL: TPλ/0211. 【Features】 ○ Measuring instrument ○ Standard ○ Thermal conductivity measurement device ○ Set MODEL: TPλ/0211 For more details, please contact us or download the catalog.

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Measuring device for ultra-low temperature thermal conductivity measurement.

Measuring device for ultra-low temperature thermal conductivity measurement.

It is a cryogenic thermal conductivity measurement device set MODEL: TPλ/0111.

The thermal conductivity measurement device focuses on absolute measurements under steady-state conditions, and many considerations and improvements have been made over the years. Yokohama Electronics Co., Ltd. has completed a thermal conductivity measurement device using the flat plate direct method, leveraging years of rich experience and outstanding technology, which is widely used as part of research and development and quality control in various industries. Introducing the ultra-low temperature thermal conductivity measurement device set MODEL: TPλ/0111. 【Features】 ○ Measuring instrument ○ Ultra-low temperature ○ Thermal conductivity measurement device ○ Set MODEL: TPλ/0111 For more details, please contact us or download the catalog.

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Materials whose thickness changes under pressure can also be measured! Thermal conductivity measurement device.

Materials whose thickness changes under pressure can also be measured! Thermal conductivity measurement device.

Automatic measurement just by setting the sample! A thermal conductivity measurement device ideal for measuring electrode materials and insulation materials.

The "IE-1230" is a thermal conductivity measurement device that measures the thermal conductivity of materials such as metals using the "temperature gradient method (plate comparison method)." It allows for easy measurement of thermal conductivity, as it automatically measures the temperature distribution and the thickness of the sample simply by setting it up, making it more convenient than conventional products. It is also capable of measuring the thickness during thermal conductivity measurement under pressure, allowing for the assessment of materials whose thickness changes under pressure. 【Features】 ■ Easy thermal conductivity measurement while applying pressure ■ Thickness can be measured under pressure using a thickness sensor ■ Automatically measures thermal conductivity after setting the sample ■ Capable of measuring thicknesses as thin as 0.05mm *For more details, please download the catalog or contact us.

  • Other environmental analysis equipment
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KES-F7 Thermo Lab

KES-F7 Thermo Lab

A testing machine that measures the "contact thermal sensation" of feeling "warm" or "cold" when the skin touches the fabric using the index "q max" (peak heat flow value).

You can use it to evaluate bedding materials with a cool and refreshing feel for summer, as well as inner materials with a warm touch for winter.

  • Testing Equipment and Devices

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[Measurement Case Studies] Thermal Conductivity Measurement

[Measurement Case Studies] Thermal Conductivity Measurement

Introduction of measurement examples such as Laser/Xenon Flash (LFA) and Steady-State Measurement Method (TIM).

This document is a collection of measurement case studies summarizing the commissioned measurements of "thermal conductivity measurement" conducted by Japan Thermal Consulting Co., Ltd. It provides detailed examples of various measurement methods such as "Laser/Xenon Flash (LFA)," "Hot Bridge (THB)," and "Heat Flow Meter (HFM)" using diagrams. Additionally, we have included a "Thermal Conductivity Measurement Equipment Selection Guideline" that summarizes measurement items, equipment, sample types, and more on one page. We encourage you to read it. 【Featured Cases (Excerpt)】 ■ Laser/Xenon Flash (LFA) ■ Hot Bridge (THB) ■ Heat Flow Meter (HFM) ■ Thin Film Samples (TFA) ■ Steady-State Measurement Method (TIM) *For more details, please refer to the PDF document or feel free to contact us.

  • Other measurement, recording and measuring instruments
  • Contract measurement

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C-THERM Contact Cooling Sensation and Thermal Conductivity Measurement Device

C-THERM Contact Cooling Sensation and Thermal Conductivity Measurement Device

It is the only measuring device compliant with ASTM D7984.

Contact cold sensation, warm sensation, and thermal conductivity measurement A contact cold and warm sensation evaluation device that replaces Q-Max, directly measuring both thermal conductivity (K) and thermal diffusivity. It employs the patented Modified Transient Plane Source (MTPS) technology. The single-sided interface thermal reflectance sensor applies an instantaneous constant heat source to the sample. Thermal conductivity and diffusivity are measured directly, providing a detailed overview of the thermal characteristics of the sample.

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[Measurement Field] Thermal Conductivity of Thin Films [TM3]

[Measurement Field] Thermal Conductivity of Thin Films [TM3]

For measuring thermal properties of thin films and micro-regions. Evaluation of heat-resistant coatings for structural components is possible.

The Thermal Microscope TM3 deposits a metal thin film on the sample and periodically heats it using a heating laser. It allows for the evaluation of heat-resistant coatings for structural components. For more details, please contact us.

  • Microscope

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Basics of Thermal Conductivity Measurement

Basics of Thermal Conductivity Measurement

Understanding the mechanism of heat transfer and effectively dissipating heat is important! Here we introduce various methods for measuring thermal properties.

Due to factors such as "miniaturization = fanless design" and "widespread use of power devices = increased heat generation," thermal issues have become important. Thermal conductivity measurement can be broadly classified into two categories: "steady-state method" and "transient method." The steady-state method provides direct thermal conductivity values and requires relatively large samples. The transient method can measure thermal diffusivity and thermal effusivity, and it is possible to measure with relatively small samples. We provide further detailed explanations, so please take a look at the PDF download below. 【Characteristics of the "Steady-State Method" and "Transient Method"】 ■ Steady-State Method - Direct thermal conductivity can be obtained - Requires relatively large samples ■ Transient Method - Can measure thermal diffusivity and thermal effusivity - Can measure with relatively small samples - Requires specific heat capacity and density *For more details, please refer to the PDF document or feel free to contact us.

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Steady-State Thermal Conductivity Measurement Device / SS-H40 Product Catalog

Steady-State Thermal Conductivity Measurement Device / SS-H40 Product Catalog

Equipped with pressure and thickness control functions! Suitable for thermal interface materials.

We aim to develop the optimal device for measuring thermal interface materials (TIM) used in semiconductor device heat dissipation. The steady-state thermal conductivity measurement device "SS-H40" is equipped with two measurement modes: "constant load mode" and "constant thickness mode," allowing for the evaluation of TIM in real-world usage conditions. In "constant load mode," measurements can be taken at a set load (units: N or Pa). On the other hand, "constant thickness mode" allows for measurements at a set thickness (units: mm). This enables measurements tailored to the usage environment, allowing for the assessment of whether the obtained thermal conductivity meets specifications. Furthermore, the measurement time, which previously took several hours, has been reduced to 10-20 minutes, making the process easier. 〇 About the Measurement Principle 〇 This is a steady-state measurement method. The steady-state method involves applying a constant amount of heat to the material, measuring the temperature gradient when the heat is stable, and determining the thermal conductivity of the material. This method maintains a steady-state heat flow, allowing for accurate measurements. It is a widely used measurement technique.

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Analysis case: Measurement example of thermal insulation evaluation by thermal conductivity measurement.

Analysis case: Measurement example of thermal insulation evaluation by thermal conductivity measurement.

This is an introduction to a case study of insulation material analysis by a specialist in analysis. This time, we will present a measurement case using a thermal conductivity measurement device.

Measurement capabilities offered by TA Instruments ☆ Thermal analysis / glass transition, crystallization, thermogravimetric analysis, curing reactions, expansion rate, thermal conductivity, shrinkage rate, effects of moisture, etc. ☆ Viscoelastic measurements (rheology) / viscoelasticity, elastic modulus, viscosity, stress relaxation, creep, master curve, residual strain, molecular weight, molecular weight distribution, etc. ☆ Microcalorimetry / intermolecular interactions, crystallization, amorphousness, aggregation/precipitation, dispersibility, solubility, compatibility, wettability, stability, adsorption, etc. ☆ Fatigue testing / tensile strength, temperature dependence, viscoelasticity, elastic modulus, viscosity, stress relaxation, creep, master curve, residual strain, etc.

  • Analytical Equipment and Devices

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Thermal conductivity measurement device

Thermal conductivity measurement device

It is a device for measuring the thermal conductivity until the plastic material changes from a molten state to a solid state through natural heat dissipation.

- Automatic measurement of up to 50 temperature levels is possible once the sample is set. - The thermal capacity of the probe is minimized to improve measurement accuracy. - Continuous operation is possible as the piston heater follows the thermal contraction of the sample. - By vacuuming the inside of the cylinder before sample insertion, concerns about air bubble contamination in the sample are alleviated. - The piston pressurization cylinder can be used as a cleaning cylinder, making cleaning easy. - Over-temperature prevention features for the piston heater and cylinder heater. - Compact and lightweight.

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Disc Heat Flow Meter Method (ASTM E1530)

Disc Heat Flow Meter Method (ASTM E1530)

This is a method for measuring accurate thermal conductivity without performing absolute measurements of heat quantity, by simultaneously measuring a reference sample with known thermal conductivity.

This measurement method, also known as the steady-state comparison method, is referred to as the protective heat flow meter method in ASTM E1530. In this method, a reference sample with a known thermal conductivity is measured simultaneously, allowing for the accurate measurement of thermal conductivity without the need for absolute heat flow measurements. A heater and a reference calorimeter are in close contact to create a steady state with a temperature difference of approximately 30K between the top and bottom of the test specimen. The thermal conductivity is then determined from the temperature difference at both ends of the test specimen and the output of the reference calorimeter.

  • Contract measurement

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