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Thermal Conductivity Measuring Instrument - メーカー・企業8社の製品一覧とランキング

更新日: 集計期間:Jul 23, 2025~Aug 19, 2025
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Thermal Conductivity Measuring Instrumentのメーカー・企業ランキング

更新日: 集計期間:Jul 23, 2025~Aug 19, 2025
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  1. 横浜電子 Kanagawa//Industrial Electrical Equipment
  2. 岩崎通信機 Tokyo//Industrial Electrical Equipment
  3. グロッツ・ベッケルトジャパン Osaka//Trading company/Wholesale 本社
  4. 4 ベテル Ibaraki//Manufacturing and processing contract 本社・工場、東京オフィス、ハドソン研究所、ベトナム工場
  5. 5 カトーテック Kyoto//Testing, Analysis and Measurement

Thermal Conductivity Measuring Instrumentの製品ランキング

更新日: 集計期間:Jul 23, 2025~Aug 19, 2025
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  1. Materials whose thickness changes under pressure can also be measured! Thermal conductivity measurement device. 岩崎通信機
  2. C-THERM Contact Cooling Sensation and Thermal Conductivity Measurement Device グロッツ・ベッケルトジャパン 本社
  3. Measuring device for thermal conductivity measurement using the Guarded Hot Plate method (GHP method) 横浜電子
  4. Measuring device standard thermal conductivity measurement apparatus 横浜電子
  5. 4 Thermal Conductivity Measurement Device Comprehensive Catalog 横浜電子

Thermal Conductivity Measuring Instrumentの製品一覧

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Thermal Conductivity Measurement Device Comprehensive Catalog

Assist in the development of new materials for thermal insulation and cooling! Achieve reduced measurement time and expanded measurement temperature range!

The thermal conductivity measurement device manufactured by Yokohama Electronics is a high-grade model that achieves a reduction in measurement time and an expansion of the measurement temperature range by providing two channels. We have completed a thermal conductivity measurement device that adopts the flat plate direct method, which is widely used as part of research and development and quality control in various industries. 【Featured Products】 ■ Thermal Conductivity Measurement Device  □ Calibration Thermal Conductivity Measurement Device (Single Specimen / Two Specimens)  □ Chamber for LN2  □ Thermal Conductivity Control Panel ■ Standard Thermal Conductivity Measurement Device ■ Ultra-Low Temperature Thermal Conductivity Measurement Device ■ Control Panel for GHP For more details, please refer to the catalog or feel free to contact us.

  • Temperature and humidity measuring instruments
  • Other measurement, recording and measuring instruments

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Measuring device for thermal conductivity measurement (GUARD HOT PLATE)

This is a thermal conductivity measurement device that achieves a reduction in measurement time and an expansion of the measurement temperature range.

The thermal conductivity measurement device (GUARD HOT PLATE) has undergone extensive consideration and improvement over the years, focusing on absolute measurements in a steady state of heat transfer. Yokohama Electronics Co., Ltd. has completed a thermal conductivity measurement device that employs the flat plate direct method, leveraging years of rich experience and outstanding technology, and it is widely used as part of research and development and quality control in various industries. The thermal conductivity measurement device TYPE M361/3GHP JIS A 1412-11999 is a high-grade model that incorporates years of experience and modern technology, achieving a reduction in measurement time and an expansion of the measurement temperature range by providing two channels. 【Features】 - Reduction in measurement time - Expansion of measurement temperature range - High-grade model - -170 to 200℃ (with constant temperature layer for temperatures below 0℃) - 1K to 300K (with ultra-low temperature layer) For more details, please contact us or download the catalog.

  • Other measurement, recording and measuring instruments

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Measuring device for thermal conductivity measurement using the Guarded Hot Plate method (GHP method)

This is a thermal conductivity measurement device for the calibration of the Guarded Hot Plate Method (GHP method).

The thermal conductivity measurement device focuses on absolute measurements under steady-state conditions, and has undergone extensive consideration and improvement over the years. Yokohama Electronics Co., Ltd. has completed a thermal conductivity measurement device using the flat plate direct method, leveraging its rich experience and outstanding technology, which is widely used as part of research and development and quality control in various industries. The thermal conductivity measurement device using the Guarded Hot Plate method (GHP method) JIS A 1412-1-1999 employs both single specimen and double specimen methods, and utilizes a chamber for LN2. 【Features】 ○ Thermal conductivity measurement device using the Guarded Hot Plate method (GHP method) ○ JIS A 1412-1-1999 ○ Single specimen method ○ Double specimen method ○ Chamber for LN2 For more details, please contact us or download the catalog.

  • Other measurement, recording and measuring instruments

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Measuring device standard thermal conductivity measurement apparatus

Standard thermal conductivity measurement device set MODEL: TPλ/0211.

The thermal conductivity measurement device focuses on absolute measurements under steady-state conditions, and has undergone extensive consideration and improvements over the years. Yokohama Electronics Co., Ltd. has completed a thermal conductivity measurement device using the plate direct method, leveraging many years of rich experience and outstanding technology, which is widely used as part of research and development and quality control in various industries. We introduce the standard thermal conductivity measurement device set MODEL: TPλ/0211. 【Features】 ○ Measuring instrument ○ Standard ○ Thermal conductivity measurement device ○ Set MODEL: TPλ/0211 For more details, please contact us or download the catalog.

  • Other measurement, recording and measuring instruments

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Measuring device for ultra-low temperature thermal conductivity measurement.

It is a cryogenic thermal conductivity measurement device set MODEL: TPλ/0111.

The thermal conductivity measurement device focuses on absolute measurements under steady-state conditions, and many considerations and improvements have been made over the years. Yokohama Electronics Co., Ltd. has completed a thermal conductivity measurement device using the flat plate direct method, leveraging years of rich experience and outstanding technology, which is widely used as part of research and development and quality control in various industries. Introducing the ultra-low temperature thermal conductivity measurement device set MODEL: TPλ/0111. 【Features】 ○ Measuring instrument ○ Ultra-low temperature ○ Thermal conductivity measurement device ○ Set MODEL: TPλ/0111 For more details, please contact us or download the catalog.

  • Other measurement, recording and measuring instruments

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Materials whose thickness changes under pressure can also be measured! Thermal conductivity measurement device.

Automatic measurement just by setting the sample! A thermal conductivity measurement device ideal for measuring electrode materials and insulation materials.

The "IE-1230" is a thermal conductivity measurement device that measures the thermal conductivity of materials such as metals using the "temperature gradient method (plate comparison method)." It allows for easy measurement of thermal conductivity, as it automatically measures the temperature distribution and the thickness of the sample simply by setting it up, making it more convenient than conventional products. It is also capable of measuring the thickness during thermal conductivity measurement under pressure, allowing for the assessment of materials whose thickness changes under pressure. 【Features】 ■ Easy thermal conductivity measurement while applying pressure ■ Thickness can be measured under pressure using a thickness sensor ■ Automatically measures thermal conductivity after setting the sample ■ Capable of measuring thicknesses as thin as 0.05mm *For more details, please download the catalog or contact us.

  • Other environmental analysis equipment
  • Other measurement, recording and measuring instruments

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KES-F7 Thermo Lab

A testing machine that measures the "contact thermal sensation" of feeling "warm" or "cold" when the skin touches the fabric using the index "q max" (peak heat flow value).

You can use it to evaluate bedding materials with a cool and refreshing feel for summer, as well as inner materials with a warm touch for winter.

  • Testing Equipment and Devices

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[Measurement Case Studies] Thermal Conductivity Measurement

Introduction of measurement examples such as Laser/Xenon Flash (LFA) and Steady-State Measurement Method (TIM).

This document is a collection of measurement case studies summarizing the commissioned measurements of "thermal conductivity measurement" conducted by Japan Thermal Consulting Co., Ltd. It provides detailed examples of various measurement methods such as "Laser/Xenon Flash (LFA)," "Hot Bridge (THB)," and "Heat Flow Meter (HFM)" using diagrams. Additionally, we have included a "Thermal Conductivity Measurement Equipment Selection Guideline" that summarizes measurement items, equipment, sample types, and more on one page. We encourage you to read it. 【Featured Cases (Excerpt)】 ■ Laser/Xenon Flash (LFA) ■ Hot Bridge (THB) ■ Heat Flow Meter (HFM) ■ Thin Film Samples (TFA) ■ Steady-State Measurement Method (TIM) *For more details, please refer to the PDF document or feel free to contact us.

  • Other measurement, recording and measuring instruments
  • Contract measurement

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C-THERM Contact Cooling Sensation and Thermal Conductivity Measurement Device

It is the only measuring device compliant with ASTM D7984.

Contact cold sensation, warm sensation, and thermal conductivity measurement A contact cold and warm sensation evaluation device that replaces Q-Max, directly measuring both thermal conductivity (K) and thermal diffusivity. It employs the patented Modified Transient Plane Source (MTPS) technology. The single-sided interface thermal reflectance sensor applies an instantaneous constant heat source to the sample. Thermal conductivity and diffusivity are measured directly, providing a detailed overview of the thermal characteristics of the sample.

  • Temperature and humidity measuring instruments

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Disc Heat Flow Meter Method (ASTM E1530)

This is a method for measuring accurate thermal conductivity without performing absolute measurements of heat quantity, by simultaneously measuring a reference sample with known thermal conductivity.

This measurement method, also known as the steady-state comparison method, is referred to as the protective heat flow meter method in ASTM E1530. In this method, a reference sample with a known thermal conductivity is measured simultaneously, allowing for the accurate measurement of thermal conductivity without the need for absolute heat flow measurements. A heater and a reference calorimeter are in close contact to create a steady state with a temperature difference of approximately 30K between the top and bottom of the test specimen. The thermal conductivity is then determined from the temperature difference at both ends of the test specimen and the output of the reference calorimeter.

  • Contract measurement

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HFM 446 Lambda / Thermal Conductivity Measurement Device for Insulation Materials

Devices that enable energy conservation and efficient use.

The HFM 446 Lambda is a thermal conductivity measurement device suitable for measuring the thermal conductivity of materials with low conductivity, such as insulation materials. The sample is placed between a hot plate and a cold plate, and the temperature difference is adjusted while the heat flux is measured with sensors. Stability is achieved in about 15 minutes, allowing for more measurements and increased productivity. With two heat flux sensors positioned, the error remains below 0.5% within 15 minutes, and during tests lasting several days, a very stable conductivity of 0.10 to 0.25% is obtained. Reliable data can also be collected for simple inspections of product variability during the manufacturing process. 【Features】 ■ High precision, stability, and accuracy ■ Fast and easy operation ■ Automatic operation ■ Short time setting and rapid startup *For more details, please refer to the catalog or feel free to contact us.

  • Analytical Equipment and Devices

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[Measurement Field] Thermal Conductivity of Thin Films [TM3]

For measuring thermal properties of thin films and micro-regions. Evaluation of heat-resistant coatings for structural components is possible.

The Thermal Microscope TM3 deposits a metal thin film on the sample and periodically heats it using a heating laser. It allows for the evaluation of heat-resistant coatings for structural components. For more details, please contact us.

  • Microscope

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Basics of Thermal Conductivity Measurement

Understanding the mechanism of heat transfer and effectively dissipating heat is important! Here we introduce various methods for measuring thermal properties.

Due to factors such as "miniaturization = fanless design" and "widespread use of power devices = increased heat generation," thermal issues have become important. Thermal conductivity measurement can be broadly classified into two categories: "steady-state method" and "transient method." The steady-state method provides direct thermal conductivity values and requires relatively large samples. The transient method can measure thermal diffusivity and thermal effusivity, and it is possible to measure with relatively small samples. We provide further detailed explanations, so please take a look at the PDF download below. 【Characteristics of the "Steady-State Method" and "Transient Method"】 ■ Steady-State Method - Direct thermal conductivity can be obtained - Requires relatively large samples ■ Transient Method - Can measure thermal diffusivity and thermal effusivity - Can measure with relatively small samples - Requires specific heat capacity and density *For more details, please refer to the PDF document or feel free to contact us.

  • Other measurement, recording and measuring instruments

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